Place of work: Rožnov

Do you want to participate in the introduction of a new semiconductor board production technology? Do you have a technical mindset, team spirit and a desire to focus on continuous process improvement in collaboration with R&D colleagues in Rožnov pod Radhoštěm? We are looking for colleagues to join our emerging team.

Development and process integration of SiC semiconductor technologies.

• Introduction of new processes and technologies into semiconductor manufacturing with an emphasis on the final parameters of semiconductor chips. For Si and SiC technologies.
• Design, develop and qualify semiconductor wafer fabrication processes on SiC substrates
• Develop, maintain and improve unit process modules specific for SiC substrates
• Track and disposition engineering material in the Fab
• Design and supervise critical experiments, analyze data and evaluate results into written conclusions
• Identify key technology gaps and lead cross-functional teams to address them
• Work with global teams on various R&D projects
• Support the transfer of a new technology from R&D to manufacturing and contribute to successful ramp and qualification

• Master Degree or PhD in Electrical Engineering, Materials Engineering, Chemistry or Physics
• Knowledge of microelectronics and semiconductor physics
• Knowledge of electrical characterization of semiconductor devices preferred
• Experience with TCAD and finite element method computation optional
• Enterprising, Self-reliant and Flexible
• Advanced in English, written and spoken